How many packaging methods are there for LCD display ICs?
2022-08-19 17:45:21
Announcer：Shenzhen Rogin Electronics Co., Ltd
520
The common IC packaging methods include COB, COG, COF, SMT, and TAB. Below, the editor will introduce the differences between these methods:
COB: This process involves directly sticking the bare chip onto a designated position on the PCB board using adhesive. Then connect the chip electrodes to the corresponding solder pads of the PCB board through the aluminum wire used in the soldering machine. Seal and cure the chip and aluminum wire with black glue to achieve the connection between the chip and the PCB board electrodes.
The advantage of this packaging is that the IC has good sealing, and the solder joints and wires will not be damaged by external factors. However, if there is any damage, it is irreparable and can only be scrapped.
COG: Bind the chip directly onto the glass through conductive adhesive. It has the advantages of significantly reducing the volume and weight of display panels, and being easy to mass produce. However, there are also certain limitations and potential risks, such as the limited size of glass substrates, which are suitable for small-scale applications and temporarily not suitable for large-scale splicing
COF: This process involves soldering integrated circuit chips onto a soft film conveyor belt, and then connecting this soft film conveyor belt to the outer lead of a liquid crystal display device using a conductive adhesive. This is mainly applied to small volume display systems
SMT: This process is one of the manufacturing processes for LCD driver circuit boards. It is a processing method that uses mounting equipment to attach the mounted components (chips, resistors, capacitors, etc.) to the corresponding solder pad positions on the PCB board printed with solder paste, and achieves the soldering of the components on the PCB board through reflow equipment
TAB: This process is a processing method that involves bonding a soft tape with a driving circuit through ACF and hot pressing it at a certain temperature, pressure, and time to achieve the connection between the screen and the driving circuit board.
The above are 5 ways to package LCD screen ICs.
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